ALUMINUM DEOXIDIZER SOLUTION
         Basic Analysis 	-      		Deoxidizer concentration 

         Additional Analyses - 		Deoxidizer concentration w/ nitric acid

ANODIZING SOLUTION
         Basic Analysis -      		Sulfuric acid & aluminum (sulfuric anodize)

         Basic Analysis -      		Phosphoric acid & aluminum (phosphoric anodize)

         Basic Analysis -      		Chromic acid & pH (chromic acid	 anodize)

         Additional Analyses - 		Total chromic acid

				Trivalent chromium

				Surface tension

BRASS PLATING SOLUTION
         Basic Analysis -      		Copper, copper cyanide, zinc, zinc cyanide, free cyanide & 

				hydroxide

         Additional Analyses - 		Carbonates

				Hull Cell panel

BROWN/BLACK OXIDE
         Basic Analysis -      		Oxidizer & sodium hydroxide

         Additional Analyses - 		Sodium Carbonate

CADMIUM PLATING SOLUTION
         Basic Analysis -      		Cadmium, cadmium oxide, sodium       	
                               			cyanide & sodium hydroxide
         Additional Analyses - 		Sodium carbonate            
                               			Hull Cell panel 

CATALYST
         Basic Analysis -      		Palladium chloride, stannous  chloride, hydrochloric acid or
                               			specific gravity
         Additional Analyses - 		Chloride 
                                
CAUSTIC ETCH SOLUTION
         Basic Analysis -      		Sodium hydroxide & aluminum 

CHROMATE CONVERSION/CHEM FILM
	Basic Analysis -      		Chromate or chem film concentration & pH
	Additional Analyses - 		Chloride

CHROMIUM PLATING SOLUTION
	Basic Analysis -      		Chromic acid, sulfate & ratio
	Additional Analyses - 		Fluoride 
                               			Chloride 
                               			Trivalent Chromium  
                               			Hull Cell panel  
                               			Surface tension 

CLEANING SOLUTION

COPPER, ACID, PLATING SOLUTION
	Basic Analysis -      		Copper, copper sulfate, sulfuric acid & chloride
	Additional Analyses - 		Addition agents 
                               			Hull Cell panel 

COPPER, ALKALINE, PLATING SOLUTION
	Basic Analysis -      		Copper, pH 
	Additional Analyses - 		Hull Cell panel 

COPPER ANODES
	Basic Analysis -      		Phosphorus content 

COPPER CYANIDE PLATING SOLUTION
	Basic Analysis -      		Copper, copper cyanide, free cyanide & hydroxide pH
	Additional Analyses - 		Carbonates
                               			Rochelle salts 
                               			Hull Cell panel 

COPPER-PYROPHOSPHATE PLATING SOLUTION
	Basic Analysis -      		Copper, pyrophosphate, ratio & pH 
	Additional Analyses - 		Ammonia   
                               			Orthophosphate  
                               			Hull Cell panel  

ETCH BACK SOLUTION
	Basic Analysis -      		Chromic acid 
	Additional Analyses - 		Trivalent chromium 

GOLD PURITY (MIL-G-45204)

GOLD PLATING SOLUTION
	Basic Analysis -      		Gold, baume & pH  
	Additional Analyses - 		Brighteners               
                               			Other additives      
                               			Efficiency panel    

NEUTRALIZER SOLUTION 

NICKEL, BLACK, PLATING SOLUTION
	Basic Analysis -      		Nickel chloride, ammonium chloride, sodium thiocyanate, 

				zinc chloride & pH 
	Additional Analyses - 		Hull Cell panel  

NICKEL PLATING SOLUTION
	Basic Analysis -      		Nickel, nickel sulfate or sulfamate, nickel chloride, boric acid & pH
	Additional Analyses - 		Surface tension 
				Carrier
                               			Other additives 
                               			Hull Cell panel 

OXIDIZER SOLUTION  

PALLADIUM-NICKEL PLATING SOLUTION
	Basic Analysis -      		Palladium, nickel, baume & pH

RHODIUM PLATING SOLUTION
	Basic Analysis -      		Rhodium & sulfuric acid  

SENSITIZER SOLUTION  
                     
SILVER CYANIDE PLATING SOLUTION                            
	Basic Analysis -      		Silver & free cyanide 
	Additional Analyses - 		Potassium carbonate      
                               			pH                  
                               			Hull Cell panel   
TIN, ACID, PLATING SOLUTION                              
	Basic Analysis -      		Stannous tin and acid
	Additional Analyses - 		Hull Cell panel

TIN, ALKALINE, PLATING SOLUTION
	Basic Analysis -      		Tin & hydroxide 
	Additional Analyses - 		Hull Cell panel       

TIN-LEAD PLATING SOLUTION
	Basic Analysis -      		Stannous tin, lead & free fluoboric acid 
	Additional Analyses - 		Total Tin                
                               			Addition agents  
                               			Free boric acid   
                               			Hull Cell panel      
                               			Fusing of Hull Cell panel        

TIN-LEAD DEPOSIT ASSAY, SOLDER POT ASSAY AND TIN-LEAD ANODES
				
ZINC, ACID, PLATING SOLUTION
	Basic Analysis -      		Zinc, zinc chloride, total chloride,boric acid & pH
	Additional Analyses - 		Ammonia    
                               			Cloud Point     
                               			Hull Cell panel   

ZINC CYANIDE PLATING SOLUTION
	Basic Analysis -      		Zinc, zinc cyanide, sodium cyanide & sodium hydroxide
	Additional Analyses -  	Sodium carbonate
                               			Hull Cell panel     
       

ADDITIONAL PLATING ANALYSES OFFERED:

	Metallic contaminants

	Simulated carbon treatment with chemical corrections & extra Hull Cell                                            

	Consulting                                                 				

REFINING

	Solid sample preparation for AA 

	Analysis of prepared sample 

	Solution samples (AA) 

	Gravimetric gold analysis (including resins and router dust)  
        
	Gravimetric silver analysis